- 5 deposition modules for MBE of oxides, metals, and topological insulators
- Sputtering for superconducting and magnetic materials
- Surface analysis module for XPS, UPS, AES, ISS and AFM
- Linear transfer line (LTL) with true UHV 2" wafer handling
- Load-lock, wafer heating and plasma cleaning, mask handling
- UHV suitcase for sample exchange with ALD and LT-SPM